By Er-Ping Li
New complicated modeling equipment for simulating the electromagnetic houses of advanced three-d digital systems
Based at the author's broad study, this ebook units forth proven and confirmed electromagnetic modeling and simulation tools for interpreting sign and gear integrity in addition to electromagnetic interference in huge complicated digital interconnects, multilayered package deal buildings, built-in circuits, and published circuit forums. Readers will detect the kingdom of the expertise in digital package deal integration and revealed circuit board simulation and modeling. as well as well known full-wave electromagnetic computational equipment, the ebook provides new, extra subtle modeling tools, delivering readers the main complex instruments for examining and designing huge complicated digital structures.
Electrical Modeling and layout for 3D process Integration starts with a accomplished assessment of present modeling and simulation equipment for sign integrity, energy integrity, and electromagnetic compatibility. subsequent, the booklet publications readers through:
The macromodeling procedure utilized in and electromagnetic modeling and simulation of complicated interconnects in 3-dimensional built-in systems
The semi-analytical scattering matrix approach according to the N-body scattering thought for modeling of 3-dimensional digital package deal and multilayered published circuit forums with a number of vias
Two- and three-d quintessential equation equipment for the research of strength distribution networks in 3-dimensional package deal integrations
The physics-based set of rules for extracting the identical circuit of a fancy strength distribution community in 3-dimensional built-in structures and published circuit boards
An an identical circuit version of through-silicon vias
Metal-oxide-semiconductor capacitance results of through-silicon vias
Engineers, researchers, and scholars can flip to this e-book for the most recent suggestions and techniques for modeling and layout of digital packaging, three-d digital integration, built-in circuits, and revealed circuit boards.
Read or Download Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC PDF
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